The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure
نویسندگان
چکیده
Yong Xiang, Joost J. Vlassak, Maria T. Perez-Prado, Ting Y. Tsui, Andrew J. McKerrow 1 Division of Engineering and Applied Sciences, Harvard University, 29 Oxford St., Cambridge, MA 02138 2 Department of Physical Metallurgy, Centro Nacional de Investigaciones Metalurgicas, CSIC Avda.Gregorio del Amo, 8, 28040 Madrid, Spain 3 Texas Instruments Inc., MS 3736, 13560 N. Central Expressway, Dallas, TX 75243
منابع مشابه
The mechanical properties of freestanding electroplated Cu thin films
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تاریخ انتشار 2004